| 图像 | 型号 | 现有数量 | 单价(USD) | 工作温度 | 厂家 | 封装 | PDF资料 | 
	    
                            	|  | MC33887DH | 0 | 面议 | -40°C ~ 150°C(TJ) | Freescale Semiconductor - NXP | 20-SOIC(0.433",11.00mm 宽)裸焊盘 |  | 
							
    
                            	|  | MC33887DWB | 0 | 面议 | -40°C ~ 150°C(TJ) | Freescale Semiconductor - NXP | 54-BSSOP(0.295",7.50mm 宽)裸焊盘 |  | 
							
    
                            	|  | MC33486ADH | 0 | 面议 | -40°C ~ 150°C(TJ) | Freescale Semiconductor - NXP | 20-SOIC(0.433",11.00mm 宽)裸焊盘 |  | 
							
    
                            	|  | MC3PHACVDW | 0 | 面议 | -40°C ~ 105°C(TA) | Freescale Semiconductor - NXP | 28-SOIC(0.295",7.50mm 宽) |  | 
							
    
                            	|  | MC33486ADHR2 | 0 | 面议 | -40°C ~ 150°C(TJ) | Freescale Semiconductor - NXP | 20-SOIC(0.433",11.00mm 宽)裸焊盘 |  | 
							
    
                            	|  | MC33486ADHR2 | 0 | 面议 | -40°C ~ 150°C(TJ) | Freescale Semiconductor - NXP | 20-SOIC(0.433",11.00mm 宽)裸焊盘 |  | 
							
    
                            	|  | MPC17511AEPR2 | 0 | 面议 | -20°C ~ 150°C(TJ) | Freescale Semiconductor - NXP | 24-VFQFN 裸露焊盘 |  | 
							
    
                            	|  | MPC17511AEPR2 | 0 | 面议 | -20°C ~ 150°C(TJ) | Freescale Semiconductor - NXP | 24-VFQFN 裸露焊盘 |  | 
							
    
                            	|  | MPC17529EVEL | 0 | 面议 | -20°C ~ 150°C(TJ) | Freescale Semiconductor - NXP | 20-SSOP(0.209",5.30mm 宽) |  | 
							
    
                            	|  | MPC17529EVEL | 0 | 面议 | -20°C ~ 150°C(TJ) | Freescale Semiconductor - NXP | 20-SSOP(0.209",5.30mm 宽) |  | 
							
    
                            	|  | MPC17531AEVEL | 0 | 面议 | -20°C ~ 150°C(TJ) | Freescale Semiconductor - NXP | 20-SSOP(0.209",5.30mm 宽) |  | 
							
    
                            	|  | MPC17531AEVEL | 0 | 面议 | -20°C ~ 150°C(TJ) | Freescale Semiconductor - NXP | 20-SSOP(0.209",5.30mm 宽) |  | 
							
    
                            	|  | MPC17531AEVEL | 0 | 面议 | -20°C ~ 150°C(TJ) | Freescale Semiconductor - NXP | 20-SSOP(0.209",5.30mm 宽) |  | 
							
    
                            	|  | MPC17550EVEL | 0 | 面议 | -10°C ~ 150°C(TJ) | Freescale Semiconductor - NXP | 36-SSOP(0.209",5.30mm 宽) |  | 
							
    
                            	|  | MPC17550EVEL | 0 | 面议 | -10°C ~ 150°C(TJ) | Freescale Semiconductor - NXP | 36-SSOP(0.209",5.30mm 宽) |  | 
							
    
                            	|  | MC33886VW | 0 | 面议 | -40°C ~ 150°C(TJ) | Freescale Semiconductor - NXP | 20-SOIC(0.433",11.00mm 宽)裸焊盘 |  | 
							
    
                            	|  | MC3PHACVDWE | 0 | 面议 | -40°C ~ 105°C(TA) | Freescale Semiconductor - NXP | 28-SOIC(0.295",7.50mm 宽) |  | 
							
    
                            	|  | MC3PHACVPE | 0 | 面议 | -40°C ~ 105°C(TA) | Freescale Semiconductor - NXP | 28-DIP(0.600",15.24mm) |  | 
							
    
                            	|  | MC33887VW | 0 | 面议 | -40°C ~ 150°C(TJ) | Freescale Semiconductor - NXP | 20-SOIC(0.433",11.00mm 宽)裸焊盘 |  | 
							
    
                            	|  | MC3PHACVFAE | 0 | 面议 | -40°C ~ 105°C(TA) | Freescale Semiconductor - NXP | 32-LQFP |  | 
							
    
                            	|  | MC33886DHR2 | 0 | 面议 | -40°C ~ 150°C(TJ) | Freescale Semiconductor - NXP | 20-SOIC(0.433",11.00mm 宽)裸焊盘 |  | 
							
    
                            	|  | MC33886VWR2 | 0 | 面议 | -40°C ~ 150°C(TJ) | Freescale Semiconductor - NXP | 20-SOIC(0.433",11.00mm 宽)裸焊盘 |  | 
							
    
                            	|  | MC33887DHR2 | 0 | 面议 | -40°C ~ 150°C(TJ) | Freescale Semiconductor - NXP | 20-SOIC(0.433",11.00mm 宽)裸焊盘 |  | 
							
    
                            	|  | MC33887PNB | 0 | 面议 | -40°C ~ 150°C(TJ) | Freescale Semiconductor - NXP | 36-PowerQFN |  | 
							
    
                            	|  | MC33887PNBR2 | 0 | 面议 | -40°C ~ 150°C(TJ) | Freescale Semiconductor - NXP | 36-PowerQFN |  |